Seoul, South Korea — Get ready for a cooler phone experience. SK hynix, a global leader in memory chips, announced Thursday it has launched a groundbreaking new mobile DRAM designed to tackle one of the biggest challenges for new smartphones: overheating.
The company is the first in the industry to use a new material called High-K Epoxy Molding Compound (EMC). This innovative material is a game-changer for devices powered by on-device AI, where fast data transfers can cause a lot of heat.
With its new technology, SK hynix has improved the thermal conductivity of its mobile DRAM by an impressive 3.5 times, while also boosting thermal resistance by 47 percent. This is a crucial step forward for flagship smartphones that use a “package on package” structure, which stacks DRAM directly on top of the application processor to save space and speed up data transfer.
According to the company, this new tech will lead to longer battery life and a longer lifespan for smartphones, all by improving performance and reducing power consumption.
“This is a meaningful achievement that goes beyond a simple performance improvement,” said Lee Gyu-jei, head of Package Product Development at SK hynix. “It addresses the inconvenience that many high-performance smartphone users may have had.”
The secret to the tech? The company found a way to enhance the thermal conductivity of the EMC material by adding Alumina to the Silica that’s been used in it so far.
Global smartphone companies are reportedly excited about the new product, which they believe will finally help them solve the persistent heat issues in their top-tier phones.
